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Asymmetric heat pipe design to ensure perfect RAM compatibility |
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Patented VGF (Vortex Generator flow) to increase air convection around the heat pipe |
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Unique air path creating high VEF (Vacuum Effect) to optimize the airflow |
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HDT (Heat-pipe direct touch) technology to ensure rapid thermal conduction and eliminate CPU hot spots |
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“1-clip” fan bracket design for user-friendly installation |
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Dow Corning® TC-5121 thermal grease ensures the perfect thermal conduction |
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Fan RPM reduction adaptor lower the noise by 25% (ETS-N30R-HE only) |
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