Gigabyte B760 Aorus Elite AX DDR4 (LGA1700, B760, DDR4, USB3.2 Type-C, SATA3)

Rp3.345.000

Description

  • Intel® Socket LGA 1700:Support 13th and 12th Gen Series Processors
  • Unparalleled Performance:Twin 12*+1+1 Phases Digital VRM Solution
  • Dual Channel DDR5:4*SMD DIMMs with XMP 3.0 Memory Module Support
  • Next Generation Storage:3*PCIe 4.0 x4 M.2 Connectors
  • Advanced Thermal Design & M.2 Thermal Guard:To Ensure VRM Power Stability & M.2 SSD Performance
  • EZ-Latch Plus:M.2 Connectors with Quick Release & Screwless Design
  • Fast Networks:2.5GbE LAN & Wi-Fi 6E 802.11ax
  • Extended Connectivity:Rear and Front USB-C® 10Gb/s, DP, HDMI
  • Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
  • Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card

* 6+6 phases parallel power design

Performance
Connectivity
8+4 Solid Pin CPU Power Connector
Advanced Thermal Design

  1. Fully Covered MOSFET Heatsinks
  2. 5 W/mk Thermal Conductivity Pad
  3. Integrated I/O Shield
3*PCIe 4.0 x4 M.2 Connectors

    1. 1*PCIe 4.0 M.2 with Thermal Guard
    2. 2*PCIe 4.0 M.2 with Enlarged Thermal Guard
    3. M.2 EZ-Latch Plus

12+1+1 Twin Hybrid Phases Digital Power Design*

  1. 60A DrMOS
  2. PCIe 4.0 Ready PCB
  3. 6-Layer & 2X Copper PCB
* 6+6 phases parallel power design.Digital VRM design for VCORE & VCCGT.
Support 13th and 12th Gen Intel Core™ Processor
Dual Channel DDR5, 4 DIMMs
Full PCI Express 4.0 Design

    1. 1*SMD PCIe 4.0 x16 Slot with Ultra Durable™ Armor
    2. PCIe EZ-Latch

UNPARALLELED PERFORMANCE
Twin Digital VRM Design
PCIe 4.0 Design
Unlock DDR5
3 x PCIe 4.0 x4 M.2
PerfDrive
With the fast-moving technology changes, GIGABYTE always follows the latest trends and provides customers with advanced features and latest technologies. GIGABYTE motherboards are equipped with upgraded power solution, latest storage standards and outstanding connectivity to enable optimized performance for gaming.

OUTSTANDING THERMAL DESIGN
Thermal Design
Fully Covered MOSFET Heatsink
2X Copper PCB
Smart Fan 6
GIGABYTE Motherboards’ unparalleled performance is guaranteed by innovative and optimized thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full load application and gaming performance.

ULTRA DURABLE
DIY Friendly
Q-Flash Plus
GIGABYTE Ultra Durable™ design provides product durability and high-quality manufacturing process. GIGABYTE motherboards use the best components and reinforce every slots to make each of them solid and durable.

Key Feature
  • Intel® Socket LGA 1700:Support 13th and 12th Gen Series Processors
  • Unparalleled Performance:Twin 12*+1+1 Phases Digital VRM Solution
  • Dual Channel DDR5:4*SMD DIMMs with XMP 3.0 Memory Module Support
  • Next Generation Storage:3*PCIe 4.0 x4 M.2 Connectors
  • Advanced Thermal Design & M.2 Thermal Guard:To Ensure VRM Power Stability & M.2 SSD Performance
  • EZ-Latch Plus:M.2 Connectors with Quick Release & Screwless Design
  • Fast Networks:2.5GbE LAN & Intel® Wi-Fi 6E 802.11ax
  • Extended Connectivity:Rear and Front USB-C® 10Gb/s, DP, HDMI
  • Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
  • Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card

    * 6+6 phases parallel power design


* The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI Trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.
* Product specifications and product appearance may differ from country to country. We recommend that you check with your local dealers for the specifications and appearance of the products available in your country. Colors of products may not be perfectly accurate due to variations caused by photographic variables and monitor settings so it may vary from images shown on this site. Although we endeavor to present the most accurate and comprehensive information at the time of publication, we reserve the right to make changes without prior notice.

Additional information

Weight 2 kg

Specification

  • CPU
    1. LGA1700 socket: Support for the 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors*
    2. L3 cache varies with CPU

    * Please refer to “CPU Support List” for more information.

  • Chipset
    1. Intel® B760 Express Chipset
  • Memory
    1. Support for DDR5 7600(O.C.) / 7400(O.C.) / 7200(O.C.) / 7000(O.C.) / 6800(O.C.) / 6600(O.C.) / 6400(O.C.) / 6200(O.C.) / 6000(O.C.) / 5800(O.C.) / 5600(O.C.) / 5400(O.C.) / 5200(O.C.) / 4800 / 4000 MT/s memory modules
    2. 4 x DDR5 DIMM sockets supporting up to 192 GB (48 GB single DIMM capacity) of system memory
    3. Dual channel memory architecture
    4. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
    5. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
    6. Support for Extreme Memory Profile (XMP) memory modules

    (The CPU and memory configuration may affect the supported memory types, data rate (speed), and number of DRAM modules, please refer to “Memory Support List” for more information.)

  • Onboard Graphics
    Integrated Graphics Processor-Intel® HD Graphics support:

    1. 1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz
      * Support for HDMI 2.0 version and HDCP 2.3.
    2. 1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz
      * Support for DisplayPort 1.2 version and HDCP 2.3

    (Graphics specifications may vary depending on CPU support.)

  • Audio
    1. Realtek® Audio CODEC
    2. High Definition Audio
    3. 2/4/5.1/7.1-channel
      * You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings.
    4. Support for S/PDIF Out
  • LAN
    1. Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
  • Wireless Communication module
    Intel® Wi-Fi 6E AX211 (For PCB rev. 1.0)

    1. WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
    2. BLUETOOTH 5.3
    3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate

    Realtek® Wi-Fi 6E RTL8852CE (For PCB rev. 1.1)

    1. WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
    2. BLUETOOTH 5.3
    3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate

    (Actual data rate may vary depending on environment and equipment.)

  • Expansion Slots
    CPU:

    1. 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16 (PCIEX16)
      * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.

    Chipset:

    1. 2 x PCI Express x16 slots, supporting PCIe 3.0 and running at x1 (PCIEX1_1, PCIEX1_2)
  • Storage Interface
    CPU:

    1. 1 x M.2 connector (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)

    Chipset:

    1. 2 x M.2 connectors (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB, M2M_SB)
    2. 4 x SATA 6Gb/s connectors

    RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices

  • USB
    Chipset:

    1. 2 x USB Type-C® ports, with USB 3.2 Gen 2 support (1 port on the back panel, 1 port available through the internal USB header)
    2. 1 x USB 3.2 Gen 2 Type-A port (red) on the back panel
    3. 2 x USB 3.2 Gen 1 ports available through the internal USB header

    Chipset+USB 3.2 Gen 1 Hub:

    1. 4 x USB 3.2 Gen 1 ports on the back panel

    Chipset+2 USB 2.0 Hubs:

    1. 8 x USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers)
  • Internal I/O Connectors
    1. 1 x 24-pin ATX main power connector
    2. 1 x 8-pin ATX 12V power connector
    3. 1 x 4-pin ATX 12V power connector
    4. 1 x CPU fan header
    5. 1 x CPU fan/water cooling pump header
    6. 3 x system fan headers
    7. 1 x system fan/water cooling pump header
    8. 2 x addressable LED strip headers
    9. 2 x RGB LED strip headers
    10. 3 x M.2 Socket 3 connectors
    11. 4 x SATA 6Gb/s connectors
    12. 1 x front panel header
    13. 1 x front panel audio header
    14. 1 x USB Type-C® header, with USB 3.2 Gen 2 support
    15. 1 x USB 3.2 Gen 1 header
    16. 2 x USB 2.0/1.1 headers
    17. 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
    18. 1 x reset button
    19. 1 x Q-Flash Plus button
    20. 1 x reset jumper
    21. 1 x Clear CMOS jumper
  • Back Panel Connectors
    1. 1 x USB Type-C® port, with USB 3.2 Gen 2 support
    2. 1 x USB 3.2 Gen 2 Type-A port (red)
    3. 4 x USB 3.2 Gen 1 ports
    4. 4 x USB 2.0/1.1 ports
    5. 2 x SMA antenna connectors (2T2R)
    6. 1 x HDMI port
    7. 1 x DisplayPort
    8. 1 x RJ-45 port
    9. 1 x optical S/PDIF Out connector
    10. 2 x audio jacks
  • I/O Controller
    1. iTE® I/O Controller Chip
  • H/W Monitoring
    1. Voltage detection
    2. Temperature detection
    3. Fan speed detection
    4. Water cooling flow rate detection
    5. Fan fail warning
    6. Fan speed control
      * Whether the fan (pump) speed control function is supported will depend on the fan (pump) you install.
  • BIOS
    1. 1 x 256 Mbit flash
    2. Use of licensed AMI UEFI BIOS
    3. PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
  • Unique Features
    1. Support for GIGABYTE Control Center (GCC)
      * Available applications in GCC may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
    2. Support for Q-Flash
    3. Support for Q-Flash Plus
  • Bundled Software
    1. Norton® Internet Security (OEM version)
    2. LAN bandwidth management software
  • Operating System
    1. Support for Windows 11 64-bit
    2. Support for Windows 10 64-bit
  • Form Factor
    1. ATX Form Factor; 30.5cm x 24.4cm

* The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI Trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.

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