AMD Ryzen 7 5700X3D 3.0Ghz Up To 4.1Ghz Cache 96MB 105W AM4 [Box] – 8 Core – 100-100001503WOF

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Rp3.735.000

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Description

Technologies

storemi-ryzen-tech-logo
AMD StoreMI Technology

A fast and easy way to expand and accelerate the storage in a desktop PC with an AMD Ryzen™ processor.

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Zen 3
AMD “Zen 3” Core Architecture

The fastest cores in the world for PC gamers.

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AMD Ryzen™ Master Utility
AMD Ryzen™ Master Utility

The Simple and Powerful Overclocking Utility for AMD Ryzen™ processors.§

LEARN MORE

SEE MORE TECHNOLOGIES

AMD Ryzen™ 7 5700X3D

General Specifications
Regional Availability
Global, China, NA, EMEA, APJ, LATAM
Platform
Boxed Processor
Product Family
AMD Ryzen™ Processors
Product Line
AMD Ryzen™ 7 Desktop Processors
# of CPU Cores
8
# of Threads
16
Max. Boost Clock
Up to 4.1GHz
Base Clock
3.0GHz
L1 Cache
512KB
L2 Cache
4MB
L3 Cache
96MB
Default TDP
105W
Processor Technology for CPU Cores
TSMC 7nm FinFET
CPU Socket
AM4
Socket Count
1P
Thermal Solution (PIB)
Not Included
Max. Operating Temperature (Tjmax)
90°C
Launch Date
*OS Support
Windows 11 – 64-Bit Edition
Windows 10 – 64-Bit Edition
RHEL x86 64-Bit
Ubuntu x86 64-Bit
*Operating System (OS) support will vary by manufacturer.
Connectivity
PCI Express® Version
PCIe 4.0
System Memory Type
DDR4
Memory Channels
2
Max Memory Speed
2x1R

DDR4-3200

2x2R

DDR4-3200

4x1R

DDR4-2933

4x2R

DDR4-2667

Product IDs
Product ID Boxed
100-100001503WOF
100-100001503
Product ID Tray
100-000001503
Key Features
Supported Technologies
AMD StoreMI Technology
AMD “Zen 3” Core Architecture
AMD Ryzen™ Master Utility

Specification

General Specifications
Platform
Boxed Processor
Market Segment
Enthusiast Desktop
Product Family
AMD Ryzen™ Processors
Product Line
AMD Ryzen™ 7 Desktop Processors
Consumer Use
Yes
Commercial Use
No
Regional Availability
Global, China, NA, EMEA, APJ, LATAM
Former Codename
“Vermeer”
Architecture
“Zen 3”
# of CPU Cores
8
Multithreading (SMT)
Yes
# of Threads
16
Max. Boost Clock
Up to 4.1GHz
Base Clock
3.0GHz
L1 Cache
512KB
L2 Cache
4MB
L3 Cache
96MB
Default TDP
105W
Processor Technology for CPU Cores
TSMC 7nm FinFET
Processor Technology for I/O Die
12nm (Globalfoundries)
CPU Compute Die (CCD) Size
74mm²
I/O Die (IOD) Size
125mm²
Package Die Count
2
CPU Socket
AM4
Socket Count
1P
Supporting Chipsets
X570
X470
B550
B450
A520
CPU Boost Technology
Precision Boost 2
Instruction Set
x86-64
Supported Extensions
AES, AMD-V, AVX, AVX2, FMA3, MMX(+), SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64
Thermal Solution (PIB)
Not Included
Max. Operating Temperature (Tjmax)
90°C
Launch Date
*OS Support
Windows 11 – 64-Bit Edition
Windows 10 – 64-Bit Edition
RHEL x86 64-Bit
Ubuntu x86 64-Bit
*Operating System (OS) support will vary by manufacturer.
Connectivity
USB Type-C® Support
Yes
Native USB 3.2 Gen 2 (10Gbps) Ports
4
Native USB 3.2 Gen 1 (5Gbps) Ports
0
Native USB 2.0 (480Mbps) Ports
0
Native SATA Ports
2
PCI Express® Version
PCIe 4.0
Native PCIe® Lanes (Total/Usable)
24 / 20
Additional Usable PCIe Lanes from Motherboard
AMD X570

16x Gen 4

AMD X470

2x Gen 3
8x Gen 2

NVMe Support
Boot, RAID0, RAID1, RAID10
System Memory Type
DDR4
Memory Channels
2
Max. Memory
128GB
System Memory Subtype
UDIMM
Max Memory Speed
2x1R

DDR4-3200

2x2R

DDR4-3200

4x1R

DDR4-2933

4x2R

DDR4-2667

ECC Support
Yes (Requires mobo support)
Graphics Capabilities
Integrated Graphics
No
Graphics Model
Discrete Graphics Card Required
Product IDs
Product ID Boxed
100-100001503WOF
100-100001503
Product ID Tray
100-000001503
Key Features
Supported Technologies
AMD StoreMI Technology
AMD “Zen 3” Core Architecture
AMD Ryzen™ Master Utility
AMD Ryzen™ VR-Ready Premium

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