Description
HIGH PERFORMANCE
Upgraded compound improves heat transfer from chipset to cooler base or heat pipes
W/M.K = 9
Additional information
Weight | 1 kg |
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Specification
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Upgraded compound improves heat transfer from chipset to cooler base or heat pipes
Weight | 1 kg |
---|
|
||
|
||
|
||
|
||
|
||
|
||
|
||
|
You must be logged in to post a review.
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