Description
Key Features
- Supports Intel® Core™ 14th and 13th processors
- Digital twin 14+1+1 phases VRM solution
- Dual Channel DDR5:4*DIMMs with XMP 3.0 memory module support
- PCIe UD Slot X: PCIe 5.0 x16 slot with 10X strength for graphics card
- EZ-Latch Click:M.2 heatsinks with screwless design
- EZ-Latch Plus:PCIe 5.0 x16 slot & M.2 slots with quick release design
- Sensor Panel Link:Onboard video port for hassle-free in-chassis panel setup
- UC BIOS:User-Centred intuitive UX with Quick Access function
- Ultra-Fast Storage:2*M.2 PCIe 4.0 x4
- Efficient Overall Thermal:VRM Thermal Armor Advanced & M.2 Thermal Guard
- Fast Networking:2.5GbE LAN & Wi-Fi 6E with Ultra-high gain antenna
- Extended Connectivity:DP,Front USB-C® 10Gb/s, Rear USB-C® 20Gb/s
- Reliable Audio:8-Ch HD Audio & Audiophile Grade Capacitors
X marks the 14th generation! Introducing the AORUS B760 X Gen Motherboards, the most powerful platforms ever built for the Intel® Core™ 14th Gen processors. With the leading performance in DDR5 memory, the upgraded DIY-friendly innovations, and the all-new BIOS redesigned as user-centered, the AORUS B760 X Gen Motherboards are built to fully unleash the next-gen power.
OVERVIEW
Performance
Thermal
Connectivity
DIY Friendly
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14+1+1 Twin Digital VRM Design
- 8-Layer PCB
- Low Loss PCB
- 2X Copper PCB
- Premium Choke and Capacitor
*7+7 phases parallel power design
*Power stage maximum current capacity is based on VCORE Phase. -
2 x Gen 4 M.2 Slots
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Full-length PCIe slots
- 1 x PCIe 5.0 x16 with PCIe UD Slot X
- 1 x PCIe 4.0 x16
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UD Power Connector
- 8+4 pin CPU with UD Solid Pin
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Intel Core™ 14th Processors Support
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4 x DIMMs, Dual Channel DDR5
- 1
- 2
- 3
- 4
- 5
- 6
- 7
Memory
Xceed in DDR5
performance
GIGABYTE is committed to enabling the unparalleled performance of the Intel® Core™ 14th Gen processors. That is why every B760M AORUS ELITE X AX motherboard is engineered with industry-leading technologies to achieve the best-in-class DDR5 performance on the market.
Best-in-class Compatibility
*Memory overclocking and XMP support may vary. Please refer to the qualified vendor list (QVL) for details and note that product features may vary by model.
BIOS Engineering
Feature-rich BIOS functions that enable easy access to the best-in-class DDR5 performance.
DDR5 XMP Booster
one click to auto boost your DDR5 module by the highest profile
DDR5 Auto Booster
one click to boost native DDR5-5600 to 6000
High Bandwidth
one click to increase DDR5 bandwidth
Low Latency
one click to shorten DDR5 latency
XMP 3.0 User Profile
optimizes memory settings and achieve the best performance for the system
Learn more about BIOS optimizations
Hardware Craftsmanship
Maximize DDR5 performance with our advanced technology for an unparalleled gaming experience.
Shielded Memory Routing
Isolated Memory Routing
8-layer Server-grade PCB
Back Drilling Technology
Revolutionary DDR5 Technology
Robust VRM Design
Xtraordinary
power delivery
The B760M AORUS ELITE X AX motherboard is equipped with the all-digital power design to achieve peak performance of the next-gen processor while providing the best stability under heavy workloads.
Digital Twin VRM Design
Ensures stable high-power delivery for advanced overclocking.
to unleash full potential of multi-cores CPU performance
for CPU integrated GPU performance
provide stable power for CPU integrated PCIe & Memory controller
Efficient Overall Thermal
Xpress your
cool
Every B760M AORUS ELITE X AX motherboard is armored with the most advanced, full metal thermal design. These solid heatsinks are forged to keep your system cool while running fast.
VRM Thermal Armor Advanced
These solid heatsinks are forged to keep your system cool.
M.2 Thermal Guard & M.2 Thermal Guard Ext.
Smart Fan6
Cool. Quiet. Customized.
DIY-friendly Innovations
Xpeditious building process
Building your own PC is meant to be joyful and effortless. Now we introduce a variety of innovations to make the B760M AORUS ELITE X AX motherboard the most DIY-friendly ever.
EZ-Latch Designs
Effortless mechanisms that enable easy installations of components.
*For reference only; actual appearance may vary.
Sensor Panel Link
Learn more
Quick Control Elements
Reset. Update. Convenient.
PCB Crafting
Xtra layers for excellent players
As the very foundation of the motherboard, the PCB plays a subtle yet critical role in the capabilities. No gamers should overlook the details lie within the PCB layers.
8-Layer PCB
Enables dense integration, signal quality, power integrity, and low EMI for high-performance systems.
2X Copper Enhancement
Enhances system performance with improved heat dissipation, power handling, and seamless overclocking support.
56% Lower Dissipation Factor
Elevate signal integrity in high-frequency circuits with our pioneering technology, setting a new standard for high-speed electronic design.
Ultra Durable™
Xpect everything UD
GIGABYTE Ultra Durable™ Technology represents our highest standards to provide a platform for gamers that is not only powerful but also durable and reliable. The B760M AORUS ELITE X AX motherboard is built to last longer and stand stronger.
Connectivity
Xtensively versatile
The B760M AORUS ELITE X AX motherboard offers a wide range of versatilities from the cutting-edge Wi-Fi 6E support with a redesigned antenna, to an array of USB ports.
Seamless Connectivity
Enjoy reliable gaming audio
Intuitive Customization
Xplore infinite utilities
The B760M AORUS ELITE X AX motherboard is the embodiment of our relentless pursuit of BIOS optimization. And thanks to our new partnership from the community, we now make the next-gen performance more accessible in even more intuitive ways.
UC BIOS
Redesigned as user-centered and provides intuitive performance tweakers.
HWiNFO
Partnership
GIGABYTE Control Center
* The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI Trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.
* Product specifications and product appearance may differ from country to country. We recommend that you check with your local dealers for the specifications and appearance of the products available in your country. Colors of products may not be perfectly accurate due to variations caused by photographic variables and monitor settings so it may vary from images shown on this site. Although we endeavor to present the most accurate and comprehensive information at the time of publication, we reserve the right to make changes without prior notice.
Additional information
Weight | 2 kg |
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Specification
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CPULGA1700 socket: Support for the 14th, 13th, and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors*
L3 cache varies with CPU* Please refer to “CPU Support List” for more information.
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ChipsetIntel® B760 Express Chipset
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MemorySupport for DDR5 8266(O.C) / 8200(O.C) / 8000(O.C) / 7950(O.C) / 7900(O.C) / 7800(O.C) / 7600(O.C.) / 7400(O.C.) / 7200(O.C.) / 7000(O.C.) / 6800(O.C.) / 6600(O.C.) / 6400(O.C.) / 6200(O.C.) / 6000(O.C.) / 5800(O.C.) / 5600(O.C.) / 5400(O.C.) / 5200(O.C.) / 4800 / 4000 MT/s memory modules
4 x DDR5 DIMM sockets supporting up to 192 GB (48 GB single DIMM capacity) of system memory
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in
non-ECC mode)
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
(The CPU and memory configuration may affect the supported memory types, data rate (speed), and number of DRAM modules, please refer to “Memory Support List” for more information.) -
Onboard GraphicsIntegrated Graphics Processor-Intel® HD Graphics support:
– 1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz* Support for HDMI 2.1 version and HDCP 2.3.
** Support for native HDMI 2.1 TMDS compatible ports.– 1 x Front HDMI port, supporting a maximum resolution of 1920×1080@30 Hz
* Support for HDMI 1.4.
– 1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz
* Support for DisplayPort 1.2 version and HDCP 2.3
(Graphics specifications may vary depending on CPU support.)
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AudioRealtek® Audio CODEC
High Definition Audio
2/4/5.1/7.1-channel* You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings.
Support for S/PDIF Out
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LANIntel® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
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Wireless Communication moduleRealtek® Wi-Fi 6E RTL8852CE (PCB rev. 1.0/1.2)
– WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
– BLUETOOTH 5.3
– Support for 11ax 160MHz wireless standard
Intel® Wi-Fi 6E AX211 (For PCB rev. 1.1/1.3)
– WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
– BLUETOOTH 5.3
– Support for 11ax 160MHz wireless standard
(Actual data rate may vary depending on environment and equipment.) -
Expansion SlotsCPU:
– 1 x PCI Express x16 slot, supporting PCIe 5.0 and running at x16 (PCIEX16)* The PCIEX16 slot can only support a graphics card or an NVMe SSD. If only one graphics card is to be installed, be sure to install it in the PCIEX16 slot.
Chipset:
– 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x4 (PCIEX4) -
Storage InterfaceCPU:
– 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)
Chipset:
– 1 x M.2 connector (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
– 4 x SATA 6Gb/s connectors
RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices -
USBChipset:
– 1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2×2 support
– 1 x USB Type-C® port with USB 3.2 Gen 2 support, available through the
internal USB header
– 1 x USB 3.2 Gen 2 Type-A port (red) on the back panel
– 1 x USB 3.2 Gen 1 ports on the back panel
– 4 x USB 2.0/1.1 ports available through the internal USB headers
Chipset+USB 3.2 Gen 1 Hub:
– 4 x USB 3.2 Gen 1 ports (2 ports on the back panel, 2 ports available through the internal USB header)
Chipset+USB 2.0 Hub:
– 4 x USB 2.0/1.1 ports on the back panel -
Internal I/O Connectors1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x 4-pin ATX 12V power connector
1 x CPU fan header
3 x system fan headers
3 x addressable RGB Gen2 LED strip headers
1 x RGB LED strip header
2 x M.2 Socket 3 connectors
4 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x USB Type-C® header, with USB 3.2 Gen 2 support
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
2 x Thunderbolt™ add-in card connectors
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0/GC-TPM2.0 SPI V2 module only)
1 x HDMI port
1 x Q-Flash Plus button
1 x reset button
1 x reset jumper
1 x Clear CMOS jumper -
Back Panel Connectors2 x SMA antenna connectors (2T2R)
1 x USB Type-C® port, with USB 3.2 Gen 2×2 support
1 x USB 3.2 Gen 2 Type-A port (red)
3 x USB 3.2 Gen 1 ports
4 x USB 2.0/1.1 ports
1 x HDMI port
1 x DisplayPort
1 x RJ-45 port
1 x optical S/PDIF Out connector
2 x audio jacks -
I/O ControlleriTE® I/O Controller Chip
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H/W MonitoringVoltage detection
Temperature detection
Fan speed detection
Water cooling flow rate detection
Fan fail warning
Fan speed control* Whether the fan speed control function is supported will depend on the fan you install.
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BIOS1 x 256 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 -
Unique FeaturesSupport for GIGABYTE Control Center (GCC)
* Available applications in GCC may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
Support for Q-Flash
Support for Q-Flash Plus -
Bundled SoftwareNorton® Internet Security (OEM version)
LAN bandwidth management software -
Operating SystemSupport for Windows 11 64-bit
Support for Windows 10 64-bit -
Form FactorMicro ATX Form Factor; 24.4cm x 24.4cm
* The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI Trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
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