Description
| P/N | CL-O023-GROSGM-A |
|---|---|
| THERMAL CONDUCTIVITY | 4.5 W/m-k |
| COLOR | Gray |
| WEIGHT | 4g |
| VISCOSITY | 76 Pa-s |
| THERMAL IMPEDANCE | 0.185°C -in²/W |
| DENSITY | 2.55 g/cm³ |
The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
*The viscosity number of TG series is the optimized number
based on the testing result from Thermaltake.
This thermal compound application kit includes a set of easily-applied tools for immediate use.
The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use.
Non-electrical conductive compound ensures better safety measures for you and your system.
Additional information
| Weight | 0,2 kg |
|---|
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