Description
| P/N | CL-O024-GROSGM-A |
|---|---|
| THERMAL CONDUCTIVITY | 8 W/m-k |
| COLOR | Gray |
| WEIGHT | 4g |
| VISCOSITY | 47 Pa-s |
| THERMAL IMPEDANCE | 0.035°C -in²/W |
| DENSITY | 2.9 g/cm³ |
With a thermal conductivity of 8.0 W/m-k, the thermal compound also contains diamonds powder allowing users to pursue a higher heat transfer rate.
Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
*The viscosity number of TG series is the optimized number
based on the testing result from Thermaltake.
This thermal compound application kit includes a set of easily-applied tools for immediate use.
The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use.
Non-electrical conductive compound ensures better safety measures for you and your system.
Additional information
| Weight | 0,2 kg |
|---|
You must be logged in to post a review.
Reviews
There are no reviews yet.